info@ic-leader.com
- Package Cooled：
-
- Attachment Method：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Material Finish：
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6 Records
| Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
Wakefield Thermal | HEATSINK MED HEX... |
50 |
3,999
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | HEATSINK NATURAL... |
25 |
3,999
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | HI-POWER HEATSIN... |
10 |
3,999
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | 4.75X36" EXTRUSION 4... |
1 |
25
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | HI-POWER HEATSIN... |
1 |
3,999
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | 4.75X12" EXTRUSION 4... |
1 |
62
In-stock
|
Get Quote |
